Increasing electrical conductivity at selected locations of a 3D object

ABSTRACT

A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material in at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.

The present application is a continuation of U.S. application Ser. No.16/076,514 filed on Aug. 8, 2018, which was a 35 U.S.C 371 U.S. NationalStage Application of PCT/US2017/028098 filed on Apr. 18, 2017, each ofwhich is incorporated herein by reference.

BACKGROUND

Additive manufacturing may revolutionize design and manufacturing inproducing three-dimensional (3D) objects. Some forms of additivemanufacturing may sometimes be referred to as 3D printing. Someadditively manufactured 3D objects may have functional characteristics,such as mechanical or electrical utility, while other 3D objects maysimply be made for aesthetic purposes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-2A are each a diagram schematically representing an exampledevice to additively manufacture a 3D object, including an exampletreatment portion.

FIG. 2B is a block diagram schematically representing an example 3Dobject including an internal electrically conductive structure.

FIG. 3 is a diagram schematically representing an example treatmentportion including an example chemical treatment or an example thermaltreatment.

FIG. 4 is a diagram schematically representing an example treatmentportion including an example electroplating treatment.

FIG. 5 is a diagram schematically representing an example treatmentportion including an example electroless plating treatment.

FIG. 6 is a diagram schematically representing an example treatmentportion including an example spraying treatment.

FIG. 7A is a block diagram schematically representing an example controlportion.

FIG. 7B is a block diagram schematically representing an example userinterface.

FIG. 8 is a block diagram schematically representing an examplemanufacturing engine.

FIG. 9 is a flow diagram schematically representing an example method ofadditive manufacturing.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, and in which is shown byway of illustration specific examples in which the disclosure may bepracticed. It is to be understood that other examples may be utilizedand structural or logical changes may be made without departing from thescope of the present disclosure. The following detailed description,therefore, is not to be taken in a limiting sense. It is to beunderstood that features of the various examples described herein may becombined, in part or whole, with each other, unless specifically notedotherwise.

At least some examples of the present disclosure involve additivelymanufacturing a 3D object including treating the 3D object to increase aconductivity of at least a portion of the 3D object.

In some examples, a device for additively manufacturing a 3D objectcomprises a coater, a dispenser, and a treatment portion. The coater isto coat, layer-by-layer, a build material on a build pad to form a 3Dobject. The dispenser is to dispense at least a fluid including a firstat least potentially electrically conductive material in at least someselected locations of an external surface of the 3D object. Thetreatment portion is to treat the 3D object to increase electricallyconductivity on the external surface of the 3D object at the at leastsome selected locations.

In some examples, the first at least potentially electrically conductivematerial comprises a material which is already electrically conductiveor a material which has the potential to become electrically conductiveduring or after dispensing, as described later in more detail.

In some examples, the device comprises an energy source. In someexamples, the energy source may induce fusing of selectable regions ofthe respective layers after each layer is coated relative to the buildpad. In some such examples, prior to the energy source applying energyto induce fusing, the dispenser may also dispense at least a fusingagent in selectable regions of at least some of the respective layers.

In some examples, the same energy source or a different energy sourcemay be involved in treating the 3D object to increase the electricalconductivity at the at least some selected locations of the externalsurface of the 3D object. Moreover, in some examples, the dispenser alsomay dispense a fusing agent on the remaining locations of externalsurface of the 3D object, i.e. locations other than the at least someselected locations on the external surface. Via such an arrangement,locations on the external surface of the 3D object, which do not receivethe first at least potentially electrically conductive material, may befused.

In some examples, the treatment portion comprises an environment toapply a chemical treatment or a thermal treatment to the at least someselected locations of the external surface of the 3D object. In someexamples, the treatment portion comprises an environment to causeelectroplating, electroless plating, or spraying with a secondelectrically conductive material at the at least some selected locationson the 3D object.

In some examples, via the deposition of the first at least potentiallyelectrically conductive material at the some selected locations, preciseand accurate control may be exerted over the later placement of thesecond electrically conductive material at the at least some selectedlocations.

Via at least some of these examples, an electrical conductivity issubstantially increased at the at least some selected locations of anexternal surface of an additively manufactured 3D object. Such locationsmay serve as bonding pads for other external conductive elements and/orconductive elements within the 3D object, such as an electronic via. Insome examples, this increased conductivity may enhance an appearance ofthe 3D object without otherwise generally dictating or affecting theselectable color; optical, surface properties; etc. of the additivelymanufactured 3D object.

In some examples, the selectivity may be implemented via an additiveprocess during additive manufacturing of the 3D object, in which thefirst at least potentially electrically conductive material is infusedinto any selectable voxel location on the external surface of the 3Dobject. In some examples, the selective increase of conductivity may beconfidently achieved via the treatment portion regardless of theparticular topology of the external surface of the 3D object because therespective example treatment portions do not rely on a direct line ofsight to each surface of the various topological features of the 3Dobject. As such, in some examples of the present disclosure, theincreased electrical conductivity on the external surface of the 3Dobject may be contiguous despite discontinuities and/or changes inorientation, angle; etc. of the external surface of the 3D object.Moreover, in some examples, the selectivity in increasing the electricalconductivity may be implemented without the use of masks.

In some examples; different second electrically conductive materials maybe added via a treatment portion to different selected locations,thereby enabling differentiation in the type of metallic finish and/ordegree of electrical conductivity and/or magnetic properties at aparticular selected location.

These examples, and additional examples, are described and illustratedin association with at least FIGS. 1-9 .

FIG. 1 is a diagram schematically representing an example device 20. Asshown in FIG. 1 , in some examples, the device 20 comprises amanufacturing portion 30 to additively manufacture an example 3D objectand a treatment portion 110. In some examples, the manufacturing portion30 comprises a material coater 50 and a fluid dispenser 58. Themanufacturing portion 30 may sometimes be referred to as a buildenvironment.

The material coater 50 is arranged to coat a build materiallayer-by-layer onto a build pad 42 to additively form a 3D object 80shown in FIG. 1 . Once formed, the 3D object may be separated from thebuild pad 42. It will be understood that a 3D object of any shape can bemanufactured, and the object 80 depicted in FIG. 1 provides just oneexample shape of a 3D object. In some instances manufacturing portion 30may sometimes be referred to as a 3D printer. Accordingly, the build pad42 may sometimes be referred to as a print bed or a receiving surface.

It will be understood that the coater 50 may be implemented via avariety of electromechanical or mechanical mechanisms, such as doctorblades, slot dies, and/or other structures suitable to spread and/orotherwise form a coating of the build material in a generally uniformlayer relative to the build pad 42 or relative to a previously depositedlayer of build material.

In some examples, the material coater 50 has a length (L1) at leastgenerally matching an entire length (L1) of the build pad 42, such thatthe material coater 50 is capable of coating the entire build pad 42with a layer 82A of build material in a single pass as the materialcoater 50 travels the width (W1) of the build pad 42. In some examples,the material coater 50 can selectively deposit layers of material inlengths and patterns less than a full length of the material coater 50.In some examples, the material coater 50 may coat the build pad 42 witha layer 82A of build material(s) using multiple passes instead of asingle pass.

It will be further understood that a 3D object additively formed viamanufacturing portion 30 may have a width and/or a length less than awidth (W1) and/or length (L1) of the build pad 42.

In some examples, the material coater 50 moves in a first orientation(represented by directional arrow F) while the fluid dispenser 58 movesin a second orientation (represented by directional arrow S) generallyperpendicular to the first orientation. In some examples, the materialcoater 50 can deposit material in each pass of a back-and-forth travelpath along the first orientation while the fluid dispenser 58 candeposit fluid agents in each pass of a back-and-forth travel path alongthe second orientation. In at least some examples, one pass is completedby the material coater 50, followed by a pass of the fluid dispenser 58before a second pass of the material coater 50 is initiated, and so on.

In some examples, the material coater 50 and the dispenser 58 can bearranged to move in the same orientation, either the first orientation(F) or the second orientation (S). In some such examples, the materialcoater 50 and the dispenser 58 may be supported and moved via a singlecarriage while in some such examples, the material coater 50 anddispenser 58 may be supported and moved via separate, independentcarriages.

In some examples, the build material used to generally form the 3Dobject comprises a polymer material. In some examples, the polymermaterial comprises a polyamide material. However, a broad range ofpolymer materials may be employed as the build material. In someexamples, the build material may comprise a ceramic material. In someexamples, the build material may take the form of a powder while in someexamples, the build material may take a non-powder form. Regardless ofthe particular form, the build material is suitable for spreading,depositing, etc. in a flowable form to produce a coating (via coater 50)relative to build pad 42 and/or relative to previously coated firstlayers of the build material. In at least some examples, the buildmaterial comprises a generally electrically non-conductive material.

In some examples, the build material does not significantly exhibitelectrical properties, optical properties, magnetic properties, etc.However, if desired, at least some of these various properties may beinfused into the build material to at least some degree via fluidagent(s) 62, as later described below in more detail in association withat least FIG. 1, 2A, and FIG. 8 . Moreover, in some examples, a buildmaterial may already incorporate at least some of these properties prioremploying the build material in forming the 3D object.

In some examples, the fluid dispenser 58 shown in FIG. 1 comprises aprinting mechanism, which comprises an array of printheads, eachincluding a plurality of individually addressable nozzles forselectively ejecting fluid agents onto a layer of build material.Accordingly, in some examples, the fluid dispenser 58 may sometimes bereferred to as an addressable fluid ejection array. In some examples,the fluid dispenser 58 may eject individual droplets having a volume onthe order of ones of picoliters or on the order of ones of nanoliters.

In some examples, fluid dispenser 58 comprises a thermal inkjet (TIJ)array. In some examples, fluid dispenser 58 may comprise a piezoelectricinkjet (PIJ) array or other technologies such as aerosol jetting, anyoneof which can precisely, selectively deposit a small volume of fluid. Insome examples, fluid dispenser 58 may comprise continuous inkjettechnology.

In some examples, the fluid dispenser 58 selective dispenses droplets ona voxel-by-voxel basis. In one sense a voxel may be understood as a unitof volume in a three-dimensional space. In some examples, a resolutionof 1200 voxels per inch in the x-y plane is implemented via fluiddispenser 58. In some examples, a voxel may have a height (or thickness)of about 100 microns, although a height of the voxel may fall betweenabout 80 microns and about 100 microns. However, in some examples, aheight of a voxel may fall outside the range of about 80 to about 100microns.

In some examples, the fluid dispenser 58 has a width (W1) at leastgenerally matching an entire width (W1) of the build pad 42, andtherefore may sometimes be referred to as providing page-widemanufacturing (e.g. page wide printing). In such examples, via thisarrangement the fluid dispenser 58 can deposit fluid agents onto theentire receiving surface in a single pass as the fluid dispenser 58travels the length (L1) of the build pad 42. In some examples, the fluiddispenser 58 may deposit fluid agents onto a given layer of materialusing multiple passes instead of a single pass.

In some examples, fluid dispenser 58 may comprise, or be in fluidcommunication with, an array of reservoirs to contain various fluidagents 62. In some examples, the array of reservoirs may comprise an inksupply 156, as shown in FIG. 2A. In some examples, at least some of thefluid agents 62 may comprise a fusing agent, detailing agent, etc. toenhance formation of each layer 82A of build material. In particular,upon application onto the build material at selectable positions via thedispenser 58, the respective fusing agent and/or detailing agent maydiffuse, saturate, and/or blend into the respective layer of the buildmaterial at the selectable positions.

After forming a desired number of layers 82A of the build material, insome examples the dispenser 58 may selectively dispense droplets offluid agent(s) 62 at some selected locations 70A, 70B of an externalsurface 88 of the 3D object. It will be understood that a group ofselectable locations 70A, 70B, or multiple different groups ofselectable locations 70A, 70B, may be selected in any position, anysize, any shape, and/or combination of shapes.

In some examples, the at least some selectable locations may compriseselectable locations corresponding to an entire external surface of a 3Dobject or an entire component of a multi-component 3D object. In someexamples, the at least some selected locations correspond to an entireregion (e.g. face, side, bottom, etc.) of a 3D object.

In some examples, the dispenser 58 dispenses the fluid agent(s) of an atleast potentially electrically conductive material on a voxel-by-voxelbasis to enable precise and accurate targeting of the at leastpotentially electrically conductive material to the at least someselected locations on the external surface of the 3D object at which theelectrical conductivity may be increased later via a treatment portion,as described further below.

In some examples, the at least potentially electrically conductivematerial comprises a material which is already electrically conductiveor a material which has the potential to become electrically conductiveduring or after dispensing, as described later in more detail.

With reference to FIG. 1 , it will be understood that in some examples,each first selected location 80A, 80B in FIG. 1 may correspond to agroup of single voxels while in some examples, each first selectedlocation 80A, 80B may correspond to a single voxel.

In some examples, the treatment portion (e.g. 110 in FIG. 1 ) may behoused separate from, and independent of, the manufacturing portion 30.However, in some examples, the entire treatment portion 110 or a portionof the treatment portion 110 may be housed with and/or comprise aportion of the manufacturing portion 30.

As further shown in the diagram 200 of FIG. 2A, in some examples themanufacturing portion 30 includes an energy source 150 for irradiatingthe deposited build materials, fluid agents (e.g. fusing agent), etc. tocause heating of the material, which in turn results in the fusing ofparticles of the material relative to each other; with such fusingoccurring via melting, sintering; etc. After such fusing, a layer 82A ofbuild material is completely formed and additional layers 82A of buildmaterial may be formed in a similar manner as represented in FIG. 1 .

In some examples, the energy source 150 may comprise a gas dischargeilluminant, such as but not limited to a Halogen lamp. In some examples,the energy source 55 may comprise multiple energy sources.

As previously noted, energy source 150 may be stationary or mobile andmay operate in a single flash or multiple flash mode.

In some examples, the energy source 150 comprises a single energysource. However, in some examples, the energy source 150 comprises afirst energy source for fusing the various layers 82A of build materialand a second energy source for facilitating treatment of the at leastsome selected locations of the external surface 88 of 3D object 80 toincrease electrical conductivity. The second energy source may belocated separately from the first energy source, such as being locatedwithin or near the treatment portion 110 (FIG. 1 ).

In some examples the manufacturing portion 30 can be used to additivelyform a 3D object via a Multi Jet Fusion (MJF) process (available fromHP, Inc.). In some examples, an additive manufacturing process performedvia manufacturing portion 30 may omit at least some aspects of and/ormay include at least some aspects of: selective laser sintering (SLS);selective laser melting (SLM); 3D binder printing (e.g. 3D binderjetting); fused deposition modeling (FDM); stereolithography (SLA); orcurable liquid photopolymer jetting (Polyjet).

With these general components of manufacturing portion 30 in mind, oneexample formation of an example 3D object 80 is described.

As shown in FIG. 1 , manufacturing portion 30 manufactures 3D object 80by forming a selectable number of layers 82A of a build material. Thisformation includes using material coater 50 to coat the build pad 42 (ora preceding layer 82A) with a layer 82A of the build material and thenapplying a fluid agent 62 (e.g. at least a fusing agent) via dispenser58 at selectable portions on the current layer 82A. Irradiation of theseselectable portions by the energy source 150 (FIG. 2A) results in fusingof the build material, fusing agents, detailing agents, etc. This cycleof coating, dispensing and fusing is repeated until a selected number oflayers 82A of build material is formed into 3D object 80 as shown in atleast FIG. 1 .

After the selectable number of layers 82A is formed, and the fluiddispenser 58 dispenses one of the fluid agents 62, which is an at leastpotentially electrically conductive material, at least some selectedlocations (e.g. 70A, 70B) on the external surface 88 of the 3D object80. In some examples, the at least potentially electrically conductivematerial at these at least some selected locations act as a primerand/or a target to selectively increase electrical conductivity on theexternal surface of the 3D object.

In some examples, the at least some selectable locations (e.g. 70A, 70B)are defined solely via the uppermost layer of the 3D object, i.e. a topsurface of the 3D object such as portion 90 in FIG. 1 .

However, in some examples, the at least some selectable locations 70A,70B are defined as an exposed portion of at least some layers (e.g. 82B)which define the sides 84, bottom 86B, etc. of the 3D object 80. Portion92 of 3D object 80 provides one example. To implement this arrangement,as the pertinent layers (e.g. 82B) are coated and fused (before a nextlayer is coated), at least some of the outside voxels of thoserespective layers 82B may form the external surface 88 of the 3D object.These outside voxels may be infused via the first at least potentiallyelectrically conductive material so that they will be exposed in theenvironment of the treatment portion to enable the substantial increasein conductivity at those exposed at least some selected locations (e.g.70A, 70B). For instance, as shown in FIG. 1 , at least some of theoutside voxels of each layer 82B which form portion 92 will be infusedwith the first at least potentially electrically conductive material, asrepresented by cross-hatching 85.

In some examples, the at least some selectable locations are defined atany one of a top 86A, bottom 86B, sides 84 of the 3D object 80. In someexamples, the at least some selectable locations (e.g. 70A, 70B) atwhich electrical conductivity is increased may be contiguous over atransition between adjacent sides 84, from a bottom 86B to a side 84,etc. or any other change in orientation, angle, etc. which may present adiscontinuity or change in surface topology.

In some examples, the first at least potentially electrically conductivematerial comprises a metal material. In some examples, the metalmaterial comprises silver nanoparticles. In some examples, the silvernanoparticles are already electrically conductive when dispensed viadispenser 58. However, in some examples, the silver nanoparticles arenot electrically active when dispensed via dispenser 58 but may becomeelectrically active when dispensed via dispenser 58 along with a saltsolution, such as sodium chloride or other salts solutions.

In some examples, the metal material comprises a metal salt material, asfurther described later.

In some examples, the first at least potentially electrically conductivematerial comprises a non-metal material. In some examples, suchnon-metal materials may comprise an electrically conductive polymermaterial, a carbonaceous conductive material, or a semiconductivematerial, such as indium tin oxide (ITO) nanoparticles.

FIG. 2B is a block diagram schematically representing an example 3Dobject 180 including an example internal electrically conductivestructure 184. In some examples, the 3D object 180 comprises theportions 90, 92 including a first at least potentially electricallyconductive material, as previously described in association with the 3Dobject 80 of FIG. 1 . However, the 3D object 180 additionally comprisesan electrically conductive structure(s) 184 located (e.g, arranged)within an interior 182 of the 3D object 180. In some examples, theelectrically conductive structure 184 may be additively manufactured andmay comprise circuitry in some instances.

The conductive structure 184 is electrically connected internally toportion 90 via conductive element 185 and electrically connectedinternally to portion 92 via conductive element 186. As furtherdescribed later, at least some examples of the present disclosure mayenhance operation of the internal electrically conductive structure 184by increasing conductivity at the at least some selected locations (e.g.70A, 70B, portions 90, 92) of an external surface 88 of the 3D object 80at which a bonding pad and/or other conductive structure may be located.

In some examples, internal conductive structure 184 (FIG. 2B) is omittedfrom 3D object 80 and the respective conductive elements 185, 186 areelectrically connected to each other.

As previously noted, after formation of the 3D object 80 via themanufacturing portion 30, the treatment portion 110 is employed tosubstantially increase the electrical conductivity of the at least someselected locations. Several examples of the treatment portion 110 aredescribed below in association with at least FIGS. 3-6 . In someexamples, each of the various treatment portions described inassociation with at least FIGS. 3-6 comprise at least some ofsubstantially the same features and attributes as previously describedfor treatment portion 110 in association with FIG. 1, 2A-2B.

FIG. 3 is a diagram schematically representing an example treatmentportion 200 including an example chemical treatment or an examplethermal treatment 212 via a respective chemical or thermal source.

In some examples, during formation of the 3D object as described inassociation with at least FIGS. 1, 2A, the dispenser 58 dispenses afirst at least potentially electrically conductive material (of thefluid agent(s) 62) onto at least some selectable locations (e.g. 70A,70B) as a metal salt material. In some examples, the metal salt materialcomprises a copper salt material. In some examples, the copper saltmaterial comprises a copper formate material.

In some examples, via the first environment 210, the external surface 88of the 3D object 80 is subjected to a first treatment to decompose themetal salt material to an electrically conductive zero-valent metal.

In some examples, the first environment 210 is separate from, andindependent of the manufacturing portion 30. For instance, the 3D objectis moved from the build pad 42 to another portion of device 20 at whichthe treatment portion 210 is located.

In some examples, the treatment environment 210 provides a thermaltreatment 212. For instance, the thermal treatment may compriseproducing a first elevated temperature (e.g. about 220 degrees Celsius)at the external surface 88 of the 3D object 80, which in turn inducesdecomposition of the copper salt material into an electricallyconductive zero-valent metallic copper, as represented via dashedcross-hatching on surfaces 291, 293.

In some examples, in addition to the subjecting the 3D object to athermal treatment 212, the first environment 210 provides a chemicaltreatment 212 to which the 3D object 80 is submitted. For instance, thefirst environment 210 may comprise exposing (e.g. submerging, spraying,etc.) the exposed copper salt material to an amine solution, whichproduces copper organic complexes (i.e. a metal organic salt). Uponapplication of the thermal treatment to exposed the copper organiccomplexes to a second, lower elevated temperature (e.g. 140 degreesCelsius), the metal salt material (in the form of copper organiccomplexes) at the at least some selected locations is decomposed into anelectrically conductive zero-valent metallic copper, as represented viathe appearance of dashed cross-hatching on surfaces 291, 293.

In some examples, this copper is compatible with the build materialforming layers 82A, 82B, such as a polymer material. In some examples,via this arrangement the electrical conductivity of the zero-valentmetal copper at the locations (including surfaces 291, 293) is withinone order of magnitude of an electrical conductivity of bulk copper. Insome examples, the electrical conductivity of the zero-valent metalcopper is about 1/30^(th) of bulk copper. In some examples, theelectrical conductivity of the zero-valent metal copper is at least oneor two orders of magnitude greater than the electrical conductivity ofportions 90, 92 of 3D object 80 prior to treatment per treatment portion200.

In some examples, a thermal treatment can be applied without exposingthe 3D object to a chemical treatment. For instance, the fluid agent 62dispensed via the dispenser 58 (onto the at least some selectedlocations) comprises the first at least potentially electricallyconductive material as a metal salt material along with a polyvinylalcohol (PVAOH). After completing formation of the 3D object, uponsubmitting the 3D object into the first environment 210, a thermaltreatment is applied to heat the 3D object 80 while exposing the 3Dobject 80 to nitrogen gas, thereby causing the metal salt material atthe at least some selected locations to decompose to result in azero-valent metallic copper at the at least some selected locations, asrepresented via dashed cross-hatching on surfaces 291, 293.

In some examples, the first environment 210 may provide a chemicaltreatment without a thermal treatment.

In some examples, the first environment 210 is not separate from, andindependent of, the manufacturing portion 30. Rather the firstenvironment is incorporated at least partially within the manufacturingportion 30. For instance, in some examples, the 3D object 80 can remainon the build pad 42 and a thermal treatment may be applied via an energysource (e.g. 150 in FIG. 2 ). In some examples, the energy source usedto apply the thermal treatment for increasing electrical conductivitymay be the same energy source 150 used to fuse portions of variouslayers of the build material, such as a flash-lamp to apply flash-lamppulse(s). However, in some examples, the energy source used to apply thethermal treatment for increasing electrical conductivity may bedifferent from the energy source 150 used to fuse portions of variouslayers of the build material.

FIG. 4 is a diagram 300 schematically representing an example treatmentportion 310 including an example electroplating treatment implementedvia environment 320. As shown in FIG. 4 , via environment 320 a formed3D object 80 is at least partially submerged below a top surface 325 ofa chemical bath 322 in a container 324. In some examples, the chemicalbath 322 comprises a copper salt bath. In some examples, the copper saltbath comprises a salt bath concentrated with Cu (II) SO₄*5H₂O.

The environment 320 also comprises a battery 346 having a positive pole(+) connected via a conductive element 344 to a metal element 342, suchas bulk piece of copper. In one aspect, the metal element 342 isconsidered an anode. The battery 346 also has a negative pole (−)connected via conductive element 350 to a surface 91 of at least oneportion 90 exposed at the external surface 88 of the 3D object 80, withportion 90 acting as a cathode. Via this arrangement, the conductiveelement 350 is electrically connected to the first at least potentiallyelectrically conductive material in the portion 90 and the conductiveelement 344 is electrically connected to the first at least potentiallyelectrically conductive material in the portion 92.

Via this environment 320, an electrochemical cell is formed such thatupon applying a Voltage (e.g. 4V) for a period of time (e.g. 2 minutes),copper is plated onto surface 91 of the 3D object 80 to yield portion371 of 3D object 380 in FIG. 4 . In some examples, the electroplating isperformed at room temperature and/or under stirring.

In order to plate surface 93 of portion 92, the conductive element 350is moved to be in contact with surface 93 instead of surface 91 ofportion 90. Upon applying the Voltage for a period of time, copper isplated onto surface 93 to yield portion 373 of 3D object 380 in FIG. 4 .

Accordingly, the different portions 371, 373 of 3D object 380 are formedduring different steps or different treatments.

However, in some examples, portions 90 and 92 may be electricallyconnected to each other via an internal electrical connection extendingwithin an interior of the body of the 3D object, such as 3D object 180shown in FIG. 2B. In some such examples, both portion 90 and 92 may beelectroplated simultaneously even though the conductive element 350 ofthe electrochemical cell is electrically connected with just one of thetwo electrically conductive portions 90, 92.

As shown in FIG. 4 , portion 371 has a thickness T1 and portion 373 hasa thickness T2, which may or may not be the same as thickness T1. Insome examples, the thicknesses T1, T3 are on the order of 50 nanometersto 1 millimeter. In some examples, the thicknesses T1, 53 are on theorder of 200 nanometers to 100 microns. In some examples, thethicknesses T1, T2 may be understood as being somewhat exaggerated inFIG. 4 for illustrative purposes. In some examples, the thickness T1 orT2 is at least one order of magnitude less than a height of a voxeldefining a thickness of the layers 82A, 82B. In some examples, thethickness T1, T2 are on the same order of magnitude as the thickness orheight of a voxel defining a thickness of the layers 82A, 82B.

In some examples, the first at least potentially electrically conductivematerial at least partially defining the surface 91 of portion 90 andsurface 93 of portion 92 comprises an electrically inactive material. Inother words, at the time of being dispensed via dispenser 58, the firstat least potentially electrically conductive material was in anelectrically inactive state. Accordingly, in some examples, prior tosubmitting the 3D object 80 to a treatment portion (e.g. 300 in FIG. 4), an energy source (e.g. 150 in FIG. 2A) applies heat to portions 90,92 to cause annealing of the surfaces 91, 93 of respective portions 90,92, thereby transforming the first at least potentially electricallyconductive material in portions 90, 92 from an electrically inactivestate to an electrically active state.

In some examples, this annealing is performed while the 3D objectremains on the build pad 42. However, in some examples, the 3D object 80is first removed from build pad 42, and the annealing is implemented viaan energy source accessible apart from build pad 42.

In some examples, the electrically conductive element 342 may comprise anon-metal material, which can be electroplated onto surfaces 91, 93.Such non-metal materials may comprise oxide materials, semiconductivematerials, and/or conductive polymers.

In some examples, the environment 320 of the treatment portion 310 alsomay enhance a smoothness, appearance, etc. of the surfaces 374, 376 ofelectroplated portions 371, 373. For instance, the chemical bath 322 mayfurther comprise levelers, brighteners, carriers, and/or other additivematerials or fluids to enhance the electroplating process to affect thesmoothness, appearance, etc. of the respective surfaces 374, 376.

In some examples, the chemical bath 322 is maintained at selectable pH,selectable temperature range, concentration, electrical current, etc. Insome examples, the chemical bath 322 may comprise a surface passivator,which may minimize oxidization of the electroplated finish at surfaces374, 376.

FIG. 5 is a diagram 400 schematically representing an example treatmentportion 420 including an example electroless plating environment 440. Asshown in FIG. 5 , a formed 3D object 80 is at least partially submergedin a chemical bath 422 in container 442 of the environment 440. Thechemical bath 422 comprises at least some of substantially the samefeatures and attributes as chemical bath 322 (FIG. 4 ), except thatchemical bath 422 can cause electroplating on surfaces 91, 93 withoutthe presence of a voltage source, such as battery 346 (FIG. 4 ). In oneaspect, the constituents of the chemical bath 422 cause decomposition ofmetal salts within the bath 422, thereby causing a portion of thosemetal salts to become plated onto the surfaces 91, 93 of portions 90, 92to yield portions 471, 473 of electroless-plated 3D object 480 in FIG. 5.

It will be understood that the electroless treatment via the electrolessplating environment 440 may be performed via a chemical bath includingnon-metal materials for plating onto the surfaces 91, 93 of the 3Dobject 80.

FIG. 6 is a diagram 500 schematically representing an example treatmentportion 510 including an example spraying treatment. After formation ofthe 3D object 80 via manufacturing portion 30 (FIG. 1, 2A), the 3Dobject 80 is submitted to treatment portion 510, as shown in FIG. 6 . Insome examples, treatment portion 510 comprises a sprayer 520 to spraythe at least some selected locations (e.g. surfaces 91, 93 of portions90, 92) with a fluid or powder 522 including a second electricallyconductive material to plate the targeted at least some selectedlocations (which comprise the first at least potentially electricallyconductive material) to yield portions 571, 573 of plated 3D object 580.Accordingly, the sprayer 520 enables precise and accurate deposition ofthe second electrically conductive material solely at the at least someselected locations.

Via this arrangement, the treatment portion 510 may omit a chemical bathor other liquid environment as was described for the respectivetreatment portions in association with at least FIGS. 3-5 .

In some examples, the sprayer 520 is operated in a manner to avoidplating the peripheral edge portion 95, 97 of the respective portions90, 92, as shown in FIG. 6 . However, while not shown in FIG. 6 , insome examples the sprayer 520 may be operated to cause plating at theperipheral edge portion 95, 97 of the respective portions 90, 92 in amanner similar shown for portions 571, 573.

In some examples, an electrical connection is established between thesprayer 520 and the targeted at least some selected locations, therebyenabling selectivity in operation of sprayer 520 to target therespective at least some selected locations.

In some examples, sprayer 520 comprises an electrosprayer 532. In someexamples, sprayer 520 comprises an arc sprayer 534. In some examples,sprayer 520 comprises a plasma sprayer 536.

In some examples, the sprayer 520 may comprise a fluid dispenser, suchas fluid dispenser 58, and therefore in such examples the spraying maybe performed while the 3D object remains on the build pad 42 (FIG. 1 ).

FIG. 7A is a block diagram schematically representing a control portion600, according to one example of the present disclosure. In someexamples, control portion 600 provides one example implementation of acontrol portion forming a part of, implementing, and/or managing any oneof the devices, manufacturing portions, material coaters, fluiddispensers, energy sources, treatment portions, instructions, engines,functions, parameters, and/or methods, as described throughout examplesof the present disclosure in association with FIGS. 1-6 and 8-9 .

In some examples, control portion 600 includes a controller 602 and amemory 610. In general terms, controller 602 of control portion 600comprises at least one processor 604 and associated memories. Thecontroller 602 is electrically couplable to, and in communication with,memory 610 to generate control signals to direct operation of at leastsome the devices, manufacturing portions, material coaters, fluidsupply, fluid dispensers, energy sources, treatment portions,instructions, engines, functions, parameters, and/or methods, asdescribed throughout examples of the present disclosure. In someexamples, these generated control signals include, but are not limitedto, employing instructions 611 stored in memory 610 to at least directand manage additive manufacturing of 3D objects in the manner describedin at least some examples of the present disclosure.

In response to or based upon commands received via a user interface(e.g. user interface 620 in FIG. 7B) and/or via machine readableinstructions, controller 602 generates control signals to implementadditive manufacturing of a 3D object in accordance with at least someof the examples of the present disclosure. In some examples, controller602 is embodied in a general purpose computing device while in someexamples, controller 602 is incorporated into or associated with atleast some of the devices, manufacturing portions, material coaters,fluid supply, fluid dispensers, energy sources, treatment portions,instructions, engines, functions, parameters, and/or methods etc. asdescribed throughout examples of the present disclosure.

For purposes of this application, in reference to the controller 602,the term “processor” shall mean a presently developed or futuredeveloped processor (or processing resources) that executes sequences ofmachine readable instructions contained in a memory. In some examples,execution of the sequences of machine readable instructions, such asthose provided via memory 610 of control portion 600 cause the processorto perform actions, such as operating controller 602 to implementadditive manufacturing of 3D objects as generally described in (orconsistent with) at least some examples of the present disclosure. Themachine readable instructions may be loaded in a random access memory(RAM) for execution by the processor from their stored location in aread only memory (ROM), a mass storage device, or some other persistentstorage (e.g., non-transitory tangible medium or non-volatile tangiblemedium), as represented by memory 610. In some examples, memory 610comprises a computer readable tangible medium providing non-volatilestorage of the machine readable instructions executable by a process ofcontroller 602. In other examples, hard wired circuitry may be used inplace of or in combination with machine readable instructions toimplement the functions described. For example, controller 602 may beembodied as part of at least one application-specific integrated circuit(ASIC). In at least some examples, the controller 602 is not limited toany specific combination of hardware circuitry and machine readableinstructions, nor limited to any particular source for the machinereadable instructions executed by the controller 602.

In some examples, control portion 600 is entirely implemented within orby a stand-alone device, which has at least some of substantially thesame features and attributes as device 20 as previously described inassociation with at least FIGS. 1-9 . In some examples, the controlportion 600 is partially implemented in the device 20 and partiallyimplemented in a computing resource separate from, and independent of,the device 20 but in communication with the device 20.

In some examples, control portion 600 includes, and/or is incommunication with, a user interface 620 as shown in FIG. 7B. In someexamples, user interface 620 comprises a user interface or other displaythat provides for the simultaneous display, activation, and/or operationof at least some of the devices, manufacturing portions, materialcoaters, fluid supply, fluid dispenser, energy source, treatmentportions, instructions, engines, functions, parameters, and/or methods,as described in association with FIGS. 1-7A and 8-9 . In some examples,at least some portions or aspects of the user interface 620 are providedvia a graphical user interface (GUI), and may comprise a display 624 andinput 622.

FIG. 8 is a block diagram schematically representing a manufacturingengine 700, according to one example of the present disclosure. In someexamples, manufacturing engine 700 provides one example implementationof instructions 611 in control portion 600 in FIG. 7A suitable foroperation of device 20. In some examples, manufacturing engine 700comprises at least some of substantially the same features andattributes of instructions 611 and/or control portion 600 generally inassociation with FIG. 7A.

As shown in FIG. 8 , in some examples, manufacturing engine 700comprises a coater engine 710, a dispenser engine 720, a treatmentengine 770, a composition engine 780, and/or an energy source engine790, In some examples, the manufacturing engine 700 directs and managesadditive manufacturing of a 3D object, including coating materialsand/or dispensing materials and fluids to additively form athree-dimensional (3D) object.

In general terms, the coater engine 710 enables the selection ofmaterials to be deposited, such as coating a build material onto a buildpad 42 and/or previously formed layers of a partially formed 3D object.In some examples, the coater engine 710 comprises a material parameter712, Via the material parameter 712, the manufacturing engine 700specifies which build material(s) and the quantity of such buildmaterials which can be used to additively form a body of the 3D object.In some examples, these materials are deposited via material coater 50of manufacturing portion 30 (FIG. 1 ).

The material controlled via material parameter 512 of coater engine 510may comprise polymers, ceramics, etc. having sufficient strength,formability, toughness, etc. for the intended use of the 3D object withat least some example materials being previously described inassociation with at least FIG. 1A.

In some examples, the dispenser engine 720 may specify which agents areto be selectively deposited onto a previously deposited layer ofmaterial and/or in association with other agents. In some examples, suchagents are deposited via fluid dispenser 58 (FIG. 1 ). In some examples,the dispenser engine 720 comprises a fluid agent function 730.

In some examples, the fluid agent function 730 comprises a conductivematerial parameter 732 to control dispensing fluid agents including atleast potentially electrically conductive materials, such as at leastsome selectable locations (e.g. 70A, 70B in FIG. 1 ). In some examples,this dispensing may sometimes be referred to as arranging the at leastpotentially electrically conductive materials at the at least someselectable locations.

In some examples, the conductive material parameter 732 comprise a metalmaterial parameter 734 to specify which metal material (e.g. silvernanoparticles) will be dispensed as the first at least potentiallyelectrically conductive material. In some examples, the metal materialparameter 734 comprises a metal salt parameter 736 to specify a metalsalt (e.g. copper salt) as the first at least potentially electricallyconductive material.

In some examples, the conductive material parameter 732 comprises anon-metal material parameter 740 to specify a non-metal material, suchas carbonaceous materials, semiconductive materials, etc. as the firstat least potentially electrically conductive material.

In some examples, the fluid agent function 730 controls dispensing viadispenser 58 of a fluid agent (62 in FIG. 1 ) used as part of forminglayers 82A, 823 (FIG. 1 ) of a build material in additivelymanufacturing a 3D object. In some examples, the fluid agent function730 comprises a fusing parameter 750, a detailing parameter 752, andother parameter 754.

In some examples, the fusing parameter 750 controls dispensing of afusing agent which may facilitate fusing of the coated build materials(e.g. a build material) into a monolithic structure to form 3D object 80(FIG. 1, 2A), while the detailing parameter 752 controls dispensing of adetailing agent to complement fusing of the coated build materials. Insome examples, other agents or additional agents are dispensedselectively as controlled via other parameter 754.

It will be understood that in some examples the coater engine 710 anddispenser engine 720 are not limited to specifying the types ofmaterials, agents, etc, associated with parameters shown in FIG. 8 , butinstead may specify any type of material, agent, etc. conducive toadditively manufacturing a 3D object, with such type of materials,agents, etc. depending on the size, type, shape, use, etc. of the 3Dobject, and depending on the particular type of method used to performthe additive manufacturing of the 3D object.

With respect to the various fluid agents and/or various propertiescontrollable via dispenser engine 720, it will be understood thatdispenser 58 (FIG. 1 ) of manufacturing portion 30 may be configuredwith correspondingly separate reservoirs, delivery channels, etc. (e.g.ink supply 156 in FIG. 2A) to enable such separate fluid agents and/oradditives to be selectively dispensed as desired during the additivemanufacturing of the 3D object. Similarly, to the extent that differentbuild materials are used per parameter 712 of coater engine 710, theneach different material may be contained in separate reservoir untildeposited via coater 50 (FIG. 1 ).

In some examples, the treatment function 770 of dispenser engine 720controls at least some operations of the treatment portions previouslydescribed in association with at least FIGS. 3-6 . In some examples, thetreatment function 770 comprises a chemical parameter 771 and/or athermal parameter 772 to control application of a chemical treatment anda thermal treatment, respectively, to the 3D object 80 as described inassociation with at least FIG. 3 . In some examples, the treatmentfunction 770 comprises an electroplating parameter 773 to controlelectroplating the 3D object 80 as described in association with atleast FIG. 4 . In some examples, the treatment function 770 comprises anelectroless plating parameter 774 to control electroless plating the 3Dobject 80 as described in association with at least FIG. 5 . In someexamples, the treatment function 770 comprises spray parameter 775 tocontrol spraying the 3D object 80 as described in association with atleast FIG. 6 .

In general terms, the composition engine 780 of manufacturing engine 700enables the selection of attributes by which the selected fluid agentsare deposited via dispenser engine 720. In some examples, the selectedfluid agents include at least potentially electrically conductivematerials as described in various examples throughout the presentdisclosure. For instance, in some examples the composition engine 780comprises a location parameter 781, a size parameter 782, a shapeparameter 783, a quantity parameter 785, and/or a spacing parameter 786.The location parameter 781 can specify a location at which the variousagents and/or structural features of the 3D object 80 are located. Forinstance, the location parameter 781 may specify a location at which thefirst at least potentially electrically conductive material isdispensed. The location parameter 781 also may specify a location atwhich a fluid agent is to deposited to cause fusing (e.g. via melting,via sintering, etc.) of a layer of material. Meanwhile, the sizeparameter 782 can specify a size of the area over which the particularfluid agent (e.g. electrically conductive, fusing, color, etc.) isdeposited. The size can be specified as an absolute quantity or as arelative quantity, i.e. a size relative to a size or volume of thesurrounding material not receiving a particular fluid agent.

In some examples, the shape parameter 783 enables specifying a shapeover which a particular fluid agent is deposited, which can be absoluteor relative to the general shape of the 3D object 80. In some examples,the quantity parameter 785 enables specifying a quantity of locations atwhich a particular agent is deposited on a layer of material. In someexamples, the spacing parameter 786 enables specifying a spacing betweenmultiple locations at which a particular fluid agent is deposited.

In general terms, the energy engine 790 of manufacturing engine 700 mayspecify various processing steps on the deposited materials and agents,such as applying energy to cause fusing, etc. of the depositedmaterials. In some examples, the energy engine 790 may controlapplication of energy to anneal a first at least potentiallyelectrically conductive material for conversion from an electricallyinactive state to an electrically active state prior to submission to atreatment portion 110 (FIG. 1 ). In some examples, the energy engine 790may control application of energy to apply a thermal treatment as partof one of the treatment portions described in association with FIGS. 3-6.

In some examples, the energy engine 790 may control an amount of timethat energy from energy source (e.g. 150 in FIG. 2A) is emitted (i.e.irradiation) toward the material, agents, etc. on the build pad 42. Insome examples, the energy source 152 may irradiate the material layer ina single flash or in multiple flashes. In some examples, the energysource 152 may remain stationary (i.e. static) or may be mobile. Ineither case, during such irradiation, the energy engine 790 controls theintensity, volume, and/or rate of irradiation.

FIG. 9 is a flow diagram 900 schematically representing a method ofmanufacturing a 3D object, according to one example of the presentdisclosure. In some examples, method 900 is performed via at least someof the devices, manufacturing portions, material coaters, fluiddispensers, energy sources, treatment portions, instructions, engines,function, methods, etc, as previously described in association with atleast FIGS. 1-8 . In some examples, method 900 is performed via at leastsome of the devices, manufacturing portions, material coaters, fluiddispensers, energy sources, treatment portions, instructions, engines,function, methods, etc. other than those previously described inassociation with at least FIGS. 1-8 . In some examples, method 900 isimplemented via at least a manufacturing engine, such as manufacturingengine 700 in FIG. 9 and/or instructions 611 in FIG. 7A.

As shown in FIG. 9 , at 902 method 900 comprises forming a buildmaterial layer relative to a build pad. At 904, method 900 comprisesdispensing a fluid onto selectable portions of the build material layer.At 906, method 900 comprises repeating the forming and the dispensing toadditively manufacture a 3D object. At 907, method 900 comprisesdispensing a first at least potentially electrically conductive fluid inat least some selectable locations of an external surface of the 3Dobject. At 910, method 900 comprises treating the 3D object tosubstantially increase a relative volume of all electrically conductivematerial, including the first at least potentially electricallyconductive material, at the some selectable locations.

Although specific examples have been illustrated and described herein, avariety of alternate and/or equivalent implementations may besubstituted for the specific examples shown and described withoutdeparting from the scope of the present disclosure. This application isintended to cover any adaptations or variations of the specific examplesdiscussed herein.

The invention claimed is:
 1. A device, comprising: a coater; a dispensercontaining a fluid that includes silver nanoparticles; a treatmentportion including a chemical bath containing a metal salt; and acontroller configured to cause: the coater to coat a plurality of layersof a build material on a build pad to form a 3D object having anexternal surface, the build material in each of the plurality of layerscomprising a polymer material; the dispenser to dispense at least thefluid, including the silver nanoparticles, to at least some selectedlocations of the external surface of the 3D object to render theexternal surface of the 3D object at the at least some selectedlocations as electrically conductive; and the treatment portion to treatthe 3D object by at least partially submerging the 3D object into thechemical bath to effect decomposition of the metal salt into a metal andplating of the metal onto the external surface of the 3D object, theplating of the metal substantially increasing the electricalconductivity of the external surface of the 3D object at the at leastsome selected locations.
 2. The device of claim 1, further comprising anenergy source, wherein the controller is further configured to cause theenergy source to apply energy after the fluid has been dispensed by thedispenser to fuse the build material at the at least some selectedlocations of the external surface of the 3D object.
 3. The device ofclaim 1, wherein the treatment portion further includes a sprayer, andwherein the controller is further configured to cause the sprayer todeposit an electrically conductive material on the at least someselected locations of the external surface of the 3D object thatincludes the silver nanoparticles via at least one of electrospraying,arc spraying, and plasma spraying.
 4. The device of claim 1, wherein theplating of the metal substantially increases the electrical conductivityof the external surface of the 3D object by increasing a volume ofelectrically conductive material that includes both the silvernanoparticles and the plated metal on the at least some selectedlocations of the external surface of the 3D object.
 5. The device ofclaim 1, wherein the polymer material is polyamide.
 6. The device ofclaim 1, wherein the controller is further configured to cause thetreatment portion to deposit another electrically conductive material onthe at least some selected locations of the external surface of the 3Dobject.
 7. The device of claim 1, wherein the metal salt contained inthe chemical bath is a copper salt.
 8. The device of claim 7, whereinthe copper salt is Cu(II)SO₄*5H₂O.
 9. The device of claim 1, whereineach of the at least some selected locations is a single voxel or agroup of voxels.
 10. The device of claim 1, wherein the build materialcomprises a generally non-conductive material.
 11. A method of additivemanufacturing a 3D object, the method utilizing a device having acoater, a dispenser containing an agent and a fluid including silvernanoparticles, and a treatment portion including a chemical bathcontaining a metal salt, wherein the method comprises: by the coater,coating a build material on a build pad to form a build material layer,the build material comprising a polymer material; by the dispenser,dispensing the agent onto at least some selected locations of the buildmaterial layer; repeating the coating and the dispensing to form the 3Dobject having an external surface; by the dispenser, dispensing thefluid including the silver nanoparticles to at least some selectedlocations of the external surface of the 3D object to render theexternal surface at the at least some selected locations as electricallyconductive; and by the treatment portion, treating the external surfaceof the 3D object by at least partially submerging the 3D object into thechemical bath to effect decomposition of the metal salt into a metal andplating of the metal on the external surface of the 3D object, theplating of the metal substantially increasing the electricalconductivity of the external surface of the 3D object at the at leastsome selected locations.
 12. The method of claim 11, wherein during thetreating, the plating of the metal substantially increases theelectrical conductivity of the external surface of the 3D object byincreasing a volume of electrically conductive material that includesboth the silver nanoparticles and the plated metal on the at least someselected locations of the external surface of the 3D object.
 13. Themethod of claim 11, wherein the 3D object has an interior and the methodfurther comprises arranging an electrically conductive structure withinthe interior of the 3D object with at least one portion of theelectrically conductive structure being electrically connected to atleast one of the at least some selected locations of the externalsurface of the 3D object.